1-烃基-1-硅杂环丁烷的合成及其Si—H键伸缩振动频率与结构关系的研究

硅杂环丁烷在有机硅化学中是一类非常重要的小分子环系化合物。由于硅杂环丁烷和环丁烷的环张力相似,因而显示出较高的反应活性。例如能与某些试剂作用,生成开环产物;在光解或热解条件下,产生具有Si=C结构的高活性中间体,可用以合成多种有机硅化合物。     

含喹噁啉环的化合物改性聚己内酰胺

合成了14种由三种含喹(哑心)啉环的芳香化合物改性的聚己内酰胺(MC尼龙),并对其形态、抗冲击强度、吸水性及熔融行为等进行了表征。聚苯基单醚喹(哑心)啉(PPQ)单模型化合物对MC尼龙结晶部分几乎没有影响。少量(0.005—5.0％)吩嗪的引入使MC尼龙的颜色、形态及性能等发生巨大变化,改性体系被认为是氢键相互作用,PPQ双模型化合物的改性作用介于二者之间。     

{Cu[H_2NC(CH_2OH)_3]_2}{Pic}_2·H_2O的合成与晶体结构

三羟甲基氨基甲烷与苦味酸(Pic)铜在乙醇水混合液中反应,制得少见的不对称氢键连接的超分子化合物{Cu[H2NC(CH2OH)3]2}{Pic}2?H2O。晶体属三斜晶系,空间群为P ,晶胞参数为a = 6.894(1),b = 8.219(1),c = 13.543(3) ? ?= 79.290(1),?= 8 3.36(2), ?= 84.590(1)埃轿狢20H30CuN8O22,V = 746.9(2) 3,Z = 1,Dc = 1.774 g/cm3,F(000) = 411,?= 0.844 mm-1,R = 0.0334,Rw = 0.0863。在配合物的结构单元中, Cu2+位于对称中心,分别与2个四齿配体(三羟甲基氨基甲烷)中的2个OH,1个NH2,三齿配位,呈笼状螯合。而另一个OH,因配体和中心离子构型的限制,不参与配位。     

傅立叶变换红外光谱对灰指甲组织结构的研究

对健康指甲和灰指甲的红外光谱特征吸收峰进行了指认,并对其相应官能团的吸收峰进行了对比分析.结果表明,灰指甲增厚、变脆的原因系α-角蛋白螺旋结构遭到破坏,肽链伸展并发生断裂,形成了不同化学环境的氨基酸,同时蛋白质分子的有序排列也发生了改变.     

STUDY ON THE CARDANOL-ALDEHYDE CONDENSATION POLYMER CONTAINING BORON-NITROGEN COORDINATE BOND

Cardanol-aldehyde condensation polymer containing boron-nitrogen co-ordinate bond (CFBN) has been synthesized and characterized by IR, XPS, HPLC andDTA-TG. Its properties were also investigated. The results show that the coating filmof CFBN has excellent physico-mechanical properties, good anticorrosive properties andstable at high temperature.     

Do intramolecular halogen bonds exist? Ab initio calculations and crystal structures’ evidences

Cl···O intramolecular contacts are analysed here. Hence the Cambridge Structural Database (CSD) search was performed to find five-membered Cl–C=C–C=O pseudo-rings closed through Cl···O intramolecular contacts. Such rings were analysed and it was found that some of Cl···O distances are smaller than the corresponding sum of van der Waals radii. Additionally ab initio MP2/6-311++G(d,p) calculations and AIM analyses were carried out here on 3-chloropropenal and its fluoro derivatives to deepen the nature of intramolecular Cl···O interactions, some of findings may indicate that they are attractive and stabilizing ones. This paper is dedicated to Prof. T. M. Krygowski on the occasion of his 70th birthday     

Chemical thermodynamics

The curing of composition containing epoxy bond is complicated chemical and technological process where under temperature and pressure conditions a change of its structure occurs. The structure changes are possible to know by thermal methods as DSC, DTA, etc. and also by measurement of dielectrical response under the low frequency electrical field.     

A Chiral Helical Compound Based on Achiral Components

The title compound, [Cu(dpa)(2,2'-bipy)(H2O)2]n 1 (H2dpa = diphenic acid and 2,2'- bipy = 2,2'-bipyridine), has been synthesized and its structure was determined by single-crystal X-ray diffraction. The crystal is of orthorhombic, space group P212121 with a = 10.597(4), b = 11.317(4), c = 17.630(7) , V = 2114.3(14) 3, C24H20CuN2O6, Mr = 495.97, Z = 4, Dc = 1.558 g/cm3, μ = 1.079 mm-1, F(000) = 1020, Flack value = 0.052(18), R = 0.0430 and wR = 0.1016 for 3381 observed reflections (I > 2σ(I)). In compound 1, the dpa ligands link metal ions into helical structures in the same direction.